3D Microelectronic Packaging: From Fundamentals to by Yan Li, Deepak Goyal

By Yan Li, Deepak Goyal

This quantity offers a finished reference for graduate scholars and pros in either academia and at the basics, processing information, and purposes of 3D microelectronic packaging, an development for destiny microelectronic programs. Chapters written through specialists disguise the latest study effects and development within the following components: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, complex fabrics, warmth dissipation, thermal administration, thermal mechanical modeling, caliber, reliability, fault isolation, and failure research of 3D microelectronic applications. various pictures, tables, and didactic schematics are incorporated all through. This crucial quantity equips readers with an in-depth knowing of all features of 3D packaging, together with packaging structure, processing, thermal mechanical and moisture similar reliability matters, universal disasters, constructing components, and destiny demanding situations, supplying insights into key components for destiny examine and improvement.

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Fukushima, T. Tananka, M. Koyanagi, A resilient 3D stacked multicore processor fabricated using 46 R. Mahajan and B. Sankman die-level 3D integration and backside TSV technologies. in Proceedings of the 64th Electronic Components and Technology Conference (ECTC), pp. 304–308, May 2014 49. -J. pdf 50. H. Ikeda, Heterogeneous 3D stacking technology developments in ASET, in CPMT Symposium Japan, 2012 2nd IEEE, 2012, pp. 1–4. 6523453 51. B. Y. C. H. B. C. S. C. H. F. A. C. C. Y. C. F. H. J. Y. C. P.

Cost of probing die on a wafer needs to be balanced against the cost of package waste and need for additional test steps later in the flow) and test coverage (while checking a greater degree of die functionality before packaging is financially viable, it can also require more sophisticated Sort technology). 13 One of the key considerations in manufacturing costs is the time it takes to test units. The greater the amount of time, the lower the throughput and hence higher the costs. The goal in E-Test, Sort, and Package Level Test steps is to focus on test time minimization without impacting quality.

The smooth wall of TSV also reduces stress concentrations; this is particularly useful as the TSV assembly usually has high residual stresses and it is often exposed to large thermal stresses during fabrication 1 Layout efficiency is understood as the number of conductors per unit area. KOZ is the region where functional properties of Si are significantly affected by the stress field of the TSV. , as well as during service [19, 20]. Therefore, fabrication of TSV requires drilling small sized, slightly tapered, smooth holes of HAR in Si wafer.

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